Rogal Copper GK for Additive Manufacturing

SCHLENK offers special products of its portfolio of Rogal Copper GK for a wide range of modern era applications of additive manufacturing.

Rogal Copper GK for Additive Manufacturing

應用
3D-Printing 3D-Printing
Powder laser desposition (LMD) Powder laser desposition (LMD)
Coldspray Coldspray
Reibschweiß- und Reibabscheideprozess Friction Welding
Selective laser sintering (SLS) Selective laser sintering (SLS)
Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS) Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Electron beam powder bed fusion (EBM) Electron beam powder bed fusion (EBM)

產品名稱粒径大小 [µm]相对密度 [g/cm³]流動性tap density [g/cm³]sieve residue [µm/%]使用
Rogal Kupfer GK 0/10 VP/50347d10 ~4, d50 ~8, d90 ~15大約 3 g/cm³不流動~5>25/max. 13D-PrintingPowder laser desposition (LMD)ColdsprayReibschweiß- und ReibabscheideprozessSelective laser sintering (SLS)Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Rogal Kupfer GK 10/25 VP/50522d10 ~13, d50 ~20, d90 ~27大約 4.1不流動~5>25/max. 53D-PrintingPowder laser desposition (LMD)ColdsprayReibschweiß- und ReibabscheideprozessSelective laser sintering (SLS)Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Rogal Kupfer GK 0/25d10 ~8, d50 ~16, d90 ~25大約 4.4不流動~5,5>25/max. 53D-PrintingPowder laser desposition (LMD)ColdsprayReibschweiß- und ReibabscheideprozessSelective laser sintering (SLS)Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Rogal Kupfer GK 10/50 VP/50487d10 ~21, d50 ~36, d90 ~52大約 4.6大约 11~5,5>25/max. 53D-PrintingPowder laser desposition (LMD)ColdsprayElectron beam powder bed fusion (EBM)Selective laser sintering (SLS)Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Rogal Kupfer GK 0/50d10 ~16, d50 ~32, d90 ~53大約 4.6大约 12~5,3>50/max. 53D-PrintingPowder laser desposition (LMD)ColdsprayReibschweiß- und ReibabscheideprozessSelective laser sintering (SLS)Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Rogal Kupfer GK 0/63d10 ~19, d50 ~39, d90 ~63大約 4.7大约 12~5,4>63/max. 53D-PrintingPowder laser desposition (LMD)ColdsprayReibschweiß- und ReibabscheideprozessSelective laser sintering (SLS)Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Rogal Kupfer GK 0/80d10 ~20, d50 ~46, d90 ~78大約 5 g/cm³大约 12~5,4>80/max. 5Powder laser desposition (LMD)ColdsprayReibschweiß- und ReibabscheideprozessElectron beam powder bed fusion (EBM)
Rogal Kupfer GK 45/100d10 ~57, d50 ~79, d90 ~105大約 5 g/cm³大约 13~5,3>100/max. 5, <45/max. 10Powder laser desposition (LMD)ColdsprayReibschweiß- und ReibabscheideprozessElectron beam powder bed fusion (EBM)
Rogal Kupfer GK 0/160d10 ~45, d50 ~84, d90 ~135大約 4.8大约 15~5>160/max. 5ColdsprayReibschweiß- und ReibabscheideprozessElectron beam powder bed fusion (EBM)Selective laser sintering (SLS)

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